Intel mass-produced Foveros, a 3D advanced packaging technology
Recently, Intel announced that it has achieved mass production based on industry-leading semiconductor packaging solutions, including Intel's breakthrough 3D packaging technology, Foveros.
This technology is in production at Fab 9, New Mexico, USA, where Intel recently completed an upgrade. According to reports, Intel's 3D advanced packaging technology Foveros is able to stack computing modules vertically rather than horizontally during the manufacturing process of processors. In addition, Foveros enables Intel and its foundry customers to integrate different computing chips to optimize cost and energy efficiency. Intel has said it expects to quadruple its production capacity for 3D Foveros packaging by 2025. （TechSugar）
South Korea has designated HBM as a national strategic technology and intends to provide tax incentives to Samsung, SK hynix, and others
South Korea will designate high-bandwidth memory (HBM) technology as a national strategic technology and will provide tax incentives to HBM suppliers such as Samsung Electronics and SK hynix. (Korea National Business Daily)
"Wuhan Guangju" received another 200 million yuan in Series B financing to provide BAW filters for Samsung
Recently, Wuhan Guangju Microelectronics Co., Ltd. announced the completion of 200 million yuan in Series B financing. The investors include Ningbo Yongshang Industry, Hubei Railway Development Fund, Yangtze River Growth Capital, Hunan High-tech Venture Capital and other 7 investors. Just half a year ago, "Wuhan Guangju" just completed the A+ round of financing invested by Xiaomi.
Founded in 2017, the company is a company focusing on the development and production of RF front-end BAW/FBAR filters. A number of its products have entered the supply chain of Samsung's mobile phones and tablets through the domestic leading ODM manufacturers Wingtech and Longqi, providing high-performance BAW filters for Samsung's products. (Hard Krypton)
1. Due to U.S. export controls, Lam Research Group's revenue in Chinese mainland fell to 40% in Q2 fiscal quarter;
2. Intel and UMC will cooperate to develop a 12nm process platform, which is expected to be put into production in 2027;
3. Apple will be the first to adopt TSMC's 2nm process;
4. With a total investment of 1.5 billion yuan, Ruihong Suzhou high-end photoresist headquarters project for integrated circuits was signed and settled;
5. SAP announced a 2 billion euro restructuring plan, which will affect 8,000 jobs.