Not long ago, Honor CEO Zhao Ming warmed up at the Mobile World Congress (MWCS2024), and the new generation of folding flagship Honor Magic V3 will challenge the new height of folding thin and light, and now more information is exposed.
As you can see in the picture above, there are many suspected Honor offline store employees in Xiaohongshu who have posted photos of real machines suspected of being Honor Magic V3 (PS. I'm not sure if the real shot is Magic V2 or Magic V3), and when it is expanded, it is a punch-hole screen in the upper right corner.
The employee also said in the comment area that the press conference was held on July 15, and I don't know if the news is true ~ for everyone's reference ~
In terms of specific configuration, according to the previous revelations and official warm-up, the Honor Magic V3 will be equipped with a Snapdragon 8 Gen3 processor, support5.5G, support satellite calls, equipped with 66W fast charging and large battery, the main ultra-thin body, it is expected to be a metal middle frame, side fingerprint, will be released this month, and the competing products in the same period also have Xiaomi MIX Fold4, you can look forward to it~ Historical information