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cowos
The M1 Ultra is available in a InFO_LI package! Rather than the higher cost CoWoS-S
encapsulation
cowos
chip
apple
m1max
apple silicon
05-05
TSMC CoWoS: 5 generations of packaging technology evolved in 10 years
TSMC
cowos
encapsulation
chip
12-27
![The M1 Ultra is available in a InFO_LI package! Rather than the higher cost CoWoS-S[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)