Samsung's 3nm yield and power consumption performance is poor? The Galaxy S25 series will be supplied exclusively by Qualcomm

Xinzhixun

2024-06-19 18:44Posted on the official account of Guangdong Xinzhixun

On June 19, it was reported that although it is rumored that Samsung's new generation of flagship smartphones Galaxy S25 series will have a version with a self-developed Exynos 2500 processor, Tianfeng International Securities analyst Ming-Chi Kuo's latest revelation said that Qualcomm may be the only processor supplier for the Galaxy S25 series (Galaxy S24 supply ratio is 40%), because Exynos 2500 may not be available because of lower than expected 3nm production.

In addition, Kuo also expects the price of the Snapdragon 8 Gen 4 based on Qualcomm's self-developed Oryon CPU cores to increase by 25-30%, so Qualcomm will benefit greatly from the increased share of orders for the Samsung Galaxy S25 processor. Since TSMC is the exclusive supplier of Qualcomm Snapdragon 8 Gen 4 (using N3E), TSMC is also expected to benefit greatly from the increase in Qualcomm orders

For Samsung, the Exynos 2500 processor would have been an important tool for Samsung to reduce its dependence on Qualcomm processors, and the preliminary CPU and GPU test results of the previously exposed Exynos 2500 showed that its overall performance was better than that of the Qualcomm Snapdragon 8 Gen 3. However, judging from Ming-Chi Kuo's revelations, the yield of Samsung's 3nm process may become a key obstacle.

According to a report by Business Korea on the 18th, industry experts pointed out that the main problem facing Samsung 3nm is poor yield and power consumption, and some analysis shows that its performance is still 10~20% lower than TSMC's 3nm.

A representative of a large wafer foundry also revealed that "the difference in power consumption of advanced process chips provided by the two manufacturers is the main reason why many large customers choose TSMC", although the manufacturing cost of TSMC 3nm chips is more than 25% higher than that of 5nm, but the major gap in performance still prompts customers to choose TSMC.

"Heat dissipation has been a challenge for chip leaders for the past 20 years, but with the advent of the AI chip era, heat dissipation has become a key issue. In particular, once the mobile chip is overheated, it may affect the entire smartphone architecture, and as long as one server cabinet is overheated, it will also be like a wildfire, causing the entire server to overload (overload). The representative of the wafer foundry said.

Editor: Xinzhixun-Lin Zi

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