Intel self-exposed desktop discrete graphics card
Intel Arc's brilliant discrete graphics card was finally released, but the first mobile version was only low-end, and the desktop version had to wait.
A few days ago, Intel previewed a limited edition desktop graphics card, dual fans, dual slots, LOGO faith lights, three DP and an HDMI interface, and is expected to be full of 32 Xe cores and 16GB GDDR6 video memory. Just don't know where the "limit" is.
Today, Tom Peterson, an academician of Intel responsible for graphics technology innovation, intentionally or unintentionally exposed a part of a desktop graphics card in an interview with foreign media, and can see the PCIe x16 interface gold finger, as well as three 8-pin auxiliary power supply interfaces.
Three 8-pin connectors mean a maximum power supply capacity of 450W, is the power consumption of Intel desktop graphics cards so high? This is not easy to say, but the exposed one is obviously an engineering sample or even an evaluation sample, and you can see that the three 8-pin interfaces are not next to each other, but have a lot of space for each other.
The power supply interface is not visible on the limited edition rendering of the previous preview, and the sample card exposed earlier only uses 8 +6 pins.
Intel has announced the ATX 3.0 power specification, a single 16-pin interface can supply up to 600W, why use the traditional three 8-pin, may be because of early samples.
Realme Q5 specification exposure
A few days ago, Xu Qi, vice president of realme, has hinted on Weibo that the realme Q5 series is about to debut.
Today, the well-known exposé bloggers preemptively broke the news, revealing that the realme Q5 series will be equipped with an 80W flagship flash charge, which can be filled with 5000mAh in 30 minutes, and the blood return speed is very fast.
According to previous news, the realme Q5 series has now entered the network, and the Ministry of Industry and Information Technology has released the ID photo and basic parameter information of the machine. It shows that the machine will inherit this year's realme family design, using a "big eye" matrix dual/triple camera scheme, and the border seems to be designed at right angles.
Parameter information shows that the realme Q5 series core will be equipped with Qualcomm Snapdragon 870 flagship processor, up to 12GB memory, 512GB storage, this configuration in the Q series corresponding to the thousand yuan file is very rare, coupled with 80W flash charge, proper thousand yuan explosive model.
In other aspects, the realme Q5 series high-end version is equipped with a rear 64 million + 8 million + 2 million triple cameras, the battery is rated 4880mAh (dual battery), the body thickness is 8.65mm, the weight is 194.5g, the screen size is 6.62 inches, and the material is AMOLED.
The realme Q5 series low-end version is 13 million + 2 million rear dual camera, the battery is rated at 4880mAh, the fuselage thickness is 8.1mm, and the weight is 190g.
Henan Research Institute successfully developed semiconductor equipment tools
According to semiconductor industry observation reports, the Zhengzhou Rail Transit Information Technology Research Institute under the Great Wall of China in Zhengzhou, Henan Province, has successfully developed a fully automatic 12-inch wafer laser slotting equipment that supports the ultra-thin wafer full cutting process, which can support the 5nm DBG process.
According to the official introduction, in addition to the conventional laser slotting function, the equipment also supports the 5nm DBG process, the ultra-thin wafer full cutting function below 120 microns, the fab IGBT process-related process and the TAIKO ultra-thin ring cutting and other high-precision end processes, adding a "sharp weapon" to the localization semiconductor industry chain.
It is reported that the modular design of the device can support lasers with different pulse widths (nanoseconds, picoseconds, femtoseconds).
The independently developed optical system can realize the continuous adjustability of the width and length of the spot, cooperate with the ultra-high-precision motion control platform and other technologies, and the laser hidden cutting equipment is perfectly combined and complementary, which solves the limitation of the surface material, thickness, crystal orientation and resistivity of the laser hidden cutting equipment, truly realizes the full compatibility of the process, and effectively controls the product damage rate and improves the chip yield.
According to reports, the R&D team of Zhengzhou Rail Transit Institute and well-known experts from famous domestic universities have overcome technical problems, and have made a major breakthrough in the 5nm advanced process of domestic slotting equipment and ultra-thin technology (processors and other products), and have reached a new height in wafer processing stability, laser use efficiency, product cutting quality and so on.
OPPO K10 Pro detailed specifications leaked
Today, the detailed specifications of OPPO's new K10 Pro have been exposed, along with the "ID photo" of the mobile phone.
Judging from the information released, OPPO K10 Pro will be equipped with Qualcomm Snapdragon 888 mobile platform, using a 6.62-inch 1080P E4 material high-brush OLED screen.
In photography, it has a 16-megapixel single camera in the front and a lens of 50 million + 8 million + 2 million in the rear.
In terms of battery life, the battery of OPPO K10 Pro adopts a 5000mAh dual-cell design and supports 80W fast charging; in terms of three-dimensional size, it is 162.7×75.7×8.68mm, and weighs 196g.
Judging from the photos, the back shell of the OPPO K10 Pro is made of matte material as a whole, and the part of the rear lens module is bright, which is similar to realme's GT 2 in the arrangement rules, and the front shot is suspected of using side holes.
It is worth mentioning that yesterday the blogger broke the news that OPPO will launch a mid-range product using the Snapdragon 888 processor, and most of the parameters of the product are consistent with the K10 Pro exposed today.
SK Hynix and Solidigm launch the enterprise-class SSD P5530
Late last year, Intel issued an announcement confirming that it had received $7 billion in payments from SK Hynix's Phase I exchange, which purchased its NAND flash business, which includes Intel's factory in Dalian, China. Subsequently, SK Hynix established a subsidiary called Solidigm to transfer the storage business related to the acquisition of Intel. Solidigm is headquartered in San Jose, California, and its CEO is Rob Crooke, a veteran Intel employee.
Recently, SK Hynix announced its first technology and product cooperation with Solidigm, combining SK Hynix' 128-layer stacked 4D NAND flash memory with Solidigm's SSD master control and firmware expertise to launch the first joint product: the new enterprise-class solid-state drive (eSSD) P5530. The product supports PCIe 4.0 interfaces, offers 1TB, 2TB, and 4TB of capacity, and is optimized for performance for specific data center use cases and target deployments.
SK Hynix said that in the future, it will work with Solidigm to optimize the operations of both companies and create synergies and partnerships. SK Hynix expects to increase the competitiveness of its NAND flash business to the same level as its DRAM business through its partnership with Solidigm.
The Redmi Note 12 is connected
Today, the new Xiaomi machines with models 22041216UC and 22041216C have obtained network access permits, and according to reports, these two new machines are the Redmi Note 12 series.
Previously, Lu Weibing, president of Xiaomi Group China and general manager of the Redmi brand, confirmed that the Redmi Note series will be iterated in half a year, positioning as "performance small flagship" and "experience small flagship" respectively. In the second half of last year, Redmi has launched the Note 11 series, the main theme is "experience small flagship", then the Redmi Note 12 series to be released in the first half of this year is positioned as a "performance small flagship".
According to the news, the Redmi Note 12 series is equipped with MediaTek's high-performance processor, not the Tianji 8100. It is speculated that the Redmi Note 12 series may be equipped with MediaTek Tianji 1300 or MediaTek Tianji 8000 chips.
Among them, The Tianji 1300 is based on TSMC's 6nm process, and the eight-core CPU contains 4 Cortex-A78, of which 1 Cortex-A78 is used as a super core frequency up to 3.0GHz, and there are 4 Cortex A55 cores with a main frequency of 2.0GHz, and the GPU is ARM Mali-G77 MC9.
The Tianji 8000 is a down-frequency version of the Tianji 8100, based on the TSMC 5nm process, composed of four Cortex A78 large cores + four Cortex A55 small cores, and the large core frequency is 2.75GHz (the large core frequency of the Tianji 8100 is 2.85GHz).
It is worth noting that the industrial design of the Redmi Note 12 series is also a major attraction. It is reported that the industrial design of the Redmi Note 12 series is highly recognizable, and the performance is powerful and the battery life is long-lasting.
It is possible that the aircraft will appear around May.