Recently, overseas bloggers disassembled Apple's latest mac studio and revealed the true appearance of a fully packaged M1 Ultra chip.
The disassembly video compares AMD's Ryzen 3 3300X processor to Apple's M1 Ultra and notes that the M1 Ultra has a package area nearly three times larger than the Ryzen 3300X. It is worth noting that the M1 Ultra chip's large package area includes a memory chip in addition to the processor element.
It is understood that M1 Ultra is packaged by two M1 Max chips interlinked together through UltraFushion technology, with performance parameters that are directly doubled compared to M1 Max, equipped with 20 core CPU, up to 64 core GPU, up to 128GB of unified memory, 800GB/s memory bandwidth, and the number of transistors has reached 114 billion.