From September 25th to 27th, the 11th Automotive Electronics Innovation Conference (AEIF 2024) and Automotive Electronics Application Exhibition, jointly sponsored by China Integrated Circuit Design Innovation Alliance, China Automotive Chip Industry Innovation Strategic Alliance, and Shanghai Society of Automotive Engineers, was successfully held in Wuxi Taihu International Expo Center!
The conference lasted for two days, with 1 summit forum, 3 special forums, 1 round table forum, and 1 supply and demand matchmaking meeting, focusing on the three major fields of large model and AI computing power, automotive electronics, and artificial intelligence, and creating "Automotive Electronics Exhibition Area", "Innovative IC Design Achievement Exhibition", and "IC Design Exhibition Area", with 200+ exhibitors and brands, and 1000+ exhibition visitors.
Summit Forum
On the morning of September 25, the summit forum was presided over by Liang Yuancong, rotating chairman of the Yangtze River Delta Automotive Science and Technology Innovation Consortium. Chen Dawei, former deputy chief engineer of China Electronics Standardization Institute, Xu Kuangyi, national high-level talent, founder and chief scientist of Jiangsu Boli Technology Co., Ltd., Jin Xing, CTO of SAIC Automotive Chip Engineering Center, Cao Changfeng, chief engineer of Great Wall Motor Co., Ltd., Sun Dong, vice president of strategic business development of Hubei Xinqing Technology Co., Ltd., He Fang, head of automotive product department of GigaDevice Technology Group Co., Ltd., president of Bosch Sensortec Asia Pacific, Wang Hongyu, Vice President of Bosch Automotive Electronics Semiconductors China, and Lu Wancheng, Deputy Chief Engineer of United Automotive Electronics Co., Ltd., delivered keynote speeches respectively, discussing hot topics in the automotive electronics field, such as the next-generation intelligent automotive electronics platform, the key elements of automotive chips, the application opportunities and challenges of RISC-V chips in the automotive field, and the current situation and optimization strategies of the automotive semiconductor supply chain.
At the summit forum in the afternoon, Luo Laijun, Chief Engineer of Lianchuang Automotive Electronics Co., Ltd., Yang Mingyang, Head of Strategy and Business Development of Mobileye China, Li Dehong, Director of Market Development Department of Shanghai Huahong Hongli Semiconductor Manufacturing Co., Ltd., Yang Renping, Head of Marketing Department of Keysight Technology, Fang Liang, Head of Functional Safety and Information Security of Continental China Internet of Vehicles and Architecture Business Group, Qin Wei, Director of Automotive Electronics Division of Huada Semiconductor Co., Ltd., and Bai Riguang, Head of Kunyi Electronics Cluster Business Division, Xu Weijie, General Manager of IBM Greater China's automotive industry, shared his views and views on topics such as the R&D and innovation exploration of core key technologies for intelligent chassis, the reshaping of the chip supply chain of the global automotive industry, and the opportunities and challenges brought by digitalization and AI to car companies.
Panel Discussion:
Under artificial intelligence, how to build a new ecology of the future automotive industry?
Focusing on the hot AI, Yang Yongzhe, Deputy Director of Great Wall Motor's Product Digitalization Center, Sun Lu, Assistant General Manager of Intelligent Manufacturing Unit of Shanghai Baolong Automotive Technology Co., Ltd., Xu Weijie, General Manager of IBM Greater China Automotive Industry, Lu Wancheng, Deputy Chief Engineer of United Automotive Electronics Co., Ltd., and Sun Dong, Vice President of Strategic Business Development of Hubei Xinqing Technology Co., Ltd., shared their views on the future AI-empowered automotive industry chain from the perspectives of vehicle, system parts, and chip manufacturers. to the expectations of the whole process of sales and follow-up marketing services.
3 sub-forums, full of technical dry goods!
On September 26, the Intelligent Connected Vehicle Development Forum, the Automotive Chip and System Design Seminar, and the New Energy Vehicle Three-Electric Technology Innovation Forum were held at the same time, and more than 40 enterprise representatives and technical experts from the vehicle, system integration, research institutions, and chip design introduced their respective products and core technology competitiveness.
Reliability Classification Catalogue of Domestic Vehicle Specification Chips (2024)
As one of the important highlights of the annual AEIF conference, the release of the "2024 Domestic Vehicle Specification Chip Reliability Classification Catalog" (hereinafter referred to as the "Catalog") has attracted great attention from the industry. Cheng Jinge, Secretary-General of China Integrated Circuit Design and Innovation Alliance, officially announced the release ceremony of the "Reliability Classification Catalog of Domestic Vehicle Specification Chips (2024)" at the opening ceremony.
The 2024 Catalogue collects a total of 329 products from 106 companies, of which 100 companies have provided 307 AEC-Q100 test reports. Chen Dawei, former deputy chief engineer of China Electronics Standardization Institute, said in an in-depth analysis and interpretation of the "catalog" that overall, the quality of this year is much better than that of previous years, whether it is the integrity of AEC-Q100 report items or the specific report quality, it has been greatly improved. However, after analyzing the problems in some test reports, he also pointed out that domestic vehicle gauge chips are still in their infancy, and the relevant reliability testing and certification work needs to be further improved and improved.
In order to promote the linkage of core machines and the docking of production and demand, a number of outstanding automotive chip manufacturers such as ZTE Microelectronics, Xinyan Microelectronics, Xingchen Technology, Xinlite, Xinwang Microelectronics, Ziguang Tongxin, Suzhou Guoxin, Xihua Technology, GigaDevice, Deyiwei, RuiTek, Fudan Micro and other outstanding automotive chip manufacturers participated in the automotive supply and demand matchmaking meeting, and conducted roadshows with representatives from Geely Automobile, Changan Technology, BMW, SAIC, ZEEKR Automobile, Dongfeng Commercial Vehicle, Haineng Automobile, Denso, ZF, Bosch, United Electronics, Faurecia Clarion Electronics, Schaeffler, Representatives of engineers in charge of procurement and hardware development from Murata Electronics and other vehicle and parts manufacturers docked with each other.
2024 Golden Core Award · Automotive Electronics Innovation Selection
It is worth mentioning that at the welcome dinner on September 25, the award ceremony of the "2024 Golden Core Award · Automotive Electronics Innovation Selection" organized by the China Integrated Circuit Design Innovation Alliance was grandly held. Gu Yifan, former Secretary-General of the Brake System Branch of the China Association of Automobile Manufacturers, Lu Wancheng, Deputy Chief Engineer of United Automotive Electronics Co., Ltd., Chen Dawei, former Deputy Chief Engineer of China Electronics Standardization Institute, Jin Xing, CTO of SAIC Automotive Chip Engineering Center, Cheng Jinge, Secretary-General of China Integrated Circuit Design and Innovation Alliance, and Liu Fen, Secretary-General of Shanghai Society of Automotive Engineers, presented medals to the winners and took a group photo.·
There are four awards in this selection activity: Outstanding Product Award, Cutting-edge Product Award, Innovative Application Award, and Innovative Enterprise Award, with a total of 31 companies awarded, and the complete list of winners is as follows:
List of winners of the 2024 Golden Core Award
Product Excellence Award
Shanghai Xinwang Microelectronics Technology Co., Ltd
GigaDevice Technology Group Co., Ltd
Hubei Xinqing Technology Co., Ltd
Hangzhou Silan Microelectronics Co., Ltd
Zhuhai Jihai Semiconductor Co., Ltd
Rongpai Semiconductor (Shanghai) Co., Ltd
Shanghai Qipuwei Semiconductor Co., Ltd
Xinhai Technology (Shenzhen) Co., Ltd
China Resources Micro Integrated Circuit (Wuxi) Co., Ltd
Hunan Xinlite Electronic Technology Co., Ltd
Jiangsu Yuntu Semiconductor Co., Ltd
Hefei Jiefa Technology Co., Ltd
Cutting-edge product award
Guangdong Gaoyun Semiconductor Technology Co., Ltd
Zhixin Semiconductor Co., Ltd
Shanghai Fudan Microelectronics Group Co., Ltd
Silergy Corp. Semiconductor Technology (Hangzhou) Co., Ltd
Shenzhen Kaiyang Electronics Co., Ltd
Xi'an Ziguang Guoxin Semiconductor Co., Ltd
Shanghai Canrui Technology Co., Ltd
Sichuan Juwei Integrated Circuit Co., Ltd
Shenzhen Xihua Technology Co., Ltd
Shenzhen Zhongxing Microelectronics Technology Co., Ltd
Zhejiang Ruixi Technology Co., Ltd
Shanghai Aiwei Electronic Technology Co., Ltd
Innovative Application Award
Deyi Microelectronics Co., Ltd
Shanghai Weijing Technology Co., Ltd
Innovative Enterprise Award
Beijing CEC Huada Electronic Design Co., Ltd
Guangdong Xinjuneng Semiconductor Co., Ltd
Unisplendour Tongxin Microelectronics Co., Ltd
Chengdu Ruichengxin Micro Technology Co., Ltd
Suzhou Guoxin Technology Co., Ltd
The Golden Core Award is an industry event of great significance in the automotive electronics industry, which aims to promote the innovation and development of the automotive electronics industry and provide a display platform for outstanding enterprises and products. The purpose of this selection activity is to establish an innovation benchmark for the domestic automotive electronics industry, promote industrial development and technological progress through awards, and at the same time recommend a number of automotive electronics companies and products with leading technology, excellent quality and strong reliability for car companies, so as to accelerate the integrated development of the automotive industry chain and supply chain. The winning companies and products will receive more market attention and business opportunities, which will help enhance their visibility and competitiveness in the industry. This selection has received great attention from the industry, with more than 200 companies participating in the application and receiving more than 400,000 votes.
Trailer:
2025 Shanghai International Automotive Electronics & Semiconductor Application Exhibition (AES)
From April 22 to 24 next year, the 12th Automotive Electronics Innovation Conference (AEIF 2025) and the "2025 Shanghai International Automotive Electronics and Semiconductor Application Exhibition" jointly organized by the China Electronics Trade Promotion Association and Reed Exhibitions will be held at the same time during the Shanghai International Auto Show.
Next year's event will bring together the world's top automotive electronics manufacturers, technology suppliers, vehicle parts and research institutions, keep up with industry trends, technology hotspots, and future applications, and organize and plan a series of exciting activities, including summit forums, technical seminars, industrial supply and demand docking, enterprise visits, etc., to deeply discuss the path of automotive electronics technology and display automotive chip innovation. From intelligent driver assistance systems and in-vehicle infotainment systems to high-performance battery management technologies, cutting-edge automotive electronics will come together to revolutionize the future of mobility.
We look forward to seeing you in Shanghai next April!