From September 25th to 27th, the "2024 China Integrated Circuit Design Innovation Conference and the 4th ICDIA-IC Show" hosted by the China Integrated Circuit Design Innovation Alliance, the Management Committee of Wuxi National High-tech Industrial Development Zone, the National "Xinhuo" Entrepreneurship and Entrepreneurship Base (Platform), and Xinmaitong Exhibition was held at Wuxi Taihu International Expo Center.
With the theme of "Application Innovation, Creating a New Ecology" and the main line of "AI Application Demand and Technology Development", this year's ICDIA will focus on AI large models and chip technology, RISC-V ecology, communication and radio frequency technology, IC design and innovation Chinese chips, etc., and share innovative achievements, hot directions, latest technologies, industrial progress and future applications in the field of integrated circuit design.
The two-day conference integrates the summit forum, four special forums, enterprise display, authoritative release, and supply and demand docking, providing a cooperation and exchange platform for displaying new IC products, new technologies, and new applications. 6000+ square meters of exhibition area, 200+ exhibitors to display IC innovation achievements and machine applications, 200+ industry leaders, 500+ corporate executives, 5000+ industry guests to attend.
Summit Forum
On the morning of September 26, the summit forum was presided over by Cheng Jinge, Secretary-General of China Integrated Circuit Design Innovation Alliance.
Ms. Lu Min, Deputy Mayor of Wuxi Municipal People's Government, Professor Wei Shaojun, Chief Engineer of National 01 Special Technology and Chairman of China Integrated Circuit Design Innovation Alliance, Mr. Ye Tianchun, Chief Technical Engineer of National 02 Special Technology and Secretary-General of China Integrated Circuit Innovation Alliance, Mr. Zeng Weiwei, Second-level Researcher of Technology Division 1 of the Frontier Technology Department of the Ministry of Science and Technology, Mr. Zhang Jinwei, Deputy Secretary of the Party Working Committee, Deputy Director of the Management Committee, Deputy Secretary of the Xinwu District Party Committee and District Mayor of Wuxi High-tech Zone, Mr. Zuo Baochun, Deputy Director of Wuxi Municipal Bureau of Industry and Information Technology, Deputy Chief Engineer of National 01 Special Technology, Mr. Du Xiaoli, Executive Vice President of the Alliance, Mr. Shi Longxing, Chairman of Jiangsu Integrated Circuit Association, Professor of Southeast University, and Leader of the Alliance Expert Group, Mr. Ren Qiwei, Vice Chairman of China Integrated Circuit Design Innovation Alliance and CEO of UNISOC Unigroup, Mr. Chen Junning, Chairman of Anhui Integrated Circuit Industry Association, Professor of University of Science and Technology of China, and Member of the 01 Special Expert Group, Professor Yin Shouyi, Vice Dean of the School of Microelectronics of Tsinghua University, Professor Sun Hongbin, Vice Dean of the School of Artificial Intelligence of Xi'an Jiaotong University, As well as a number of senior experts from the National 01 Special Project and the Alliance were present.
Also present at the conference were leaders of relevant departments of Wuxi Municipal Bureau of Industry and Information Technology and Wuxi High-tech Zone, relevant governing units of China Integrated Circuit Design and Innovation Alliance, relevant leaders of the national "Xinhuo" Entrepreneurship and Entrepreneurship Base (Platform), relevant leaders of provincial and municipal integrated circuit industry associations, as well as outstanding integrated circuit enterprises at home and abroad, industry experts and professors, investment institutions and media personnel.
Lu Min, deputy mayor of Wuxi Municipal People's Government, delivered a speech for the conference, she said that Wuxi is an important town of integrated circuits in the country, and has undertaken the construction of national 65, 75, microelectronics projects and 908 projects, and has become the southern base of the national microelectronics industry and the Huangpu Military Academy and the cradle of talents in China's integrated circuits. Next, Wuxi will actively connect with the national and provincial integrated circuit industry development strategy and deployment, seize the major opportunities of the integration of the national Yangtze River Delta and the development of the Taihu Bay Science and Technology Innovation Belt, and focus on the development of strategic priorities such as the information and innovation chip ecosystem, the vehicle-grade chip innovation circle, the high-end power semiconductor industry chain, and the third-generation semiconductor industry chain.
Zhang Jinwei, deputy secretary of the Party Working Committee of Wuxi High-tech Zone, deputy director of the Management Committee, deputy secretary of the Xinwu District Party Committee and head of the district, delivered a speech for the conference, he said that Wuxi High-tech Zone, as the forefront and main position of Wuxi's integrated circuit industry, has gone through 30 years of hard work and precipitation. In the next step, Wuxi High-tech Zone will continue to be under the care and help of the Municipal Party Committee and Municipal Government, in accordance with the 12345 development path of Wuxi's integrated circuit industry, continue to promote the strong industrial chain to gather momentum, strive for advantages, and strive to build an industrial agglomeration area with obvious economies of scale.
Yin Shouyi, Vice Dean of the School of Integrated Circuits of Tsinghua University, Ren Qiwei, Executive Vice President of New Tsinghua Unigroup and CEO of UNISOC, Sun Hongbin, Deputy Dean of the School of Artificial Intelligence of Xi'an Jiaotong University, Shi Nuannuan, Researcher of the Key Laboratory of Optoelectronic Materials and Devices, Institute of Semiconductors, Chinese Academy of Sciences, Shi Wenpeng, Minister of China Household Electrical Appliances Research Institute, Yang Hongjian, General Manager of the Matchmaking Division of Electronic Components and Integrated Circuits International Trading Center Co., Ltd., and Bao Yungang, Deputy Director of the Institute of Computing Technology, Chinese Academy of Sciences, delivered keynote speeches respectively. Hot topics in the industry such as AI chips, embodied intelligence, optoelectronic computing chips, home appliance chips, and processor chip technologies were discussed.
At the summit forum in the afternoon, He Ning, Senior Vice President and Chief Technology Officer of Beijing ESWIN Computing Technology Co., Ltd., Li Mengzhang, CTO of Xin Yaohui Technology Co., Ltd., Zhao Yongchao, Head of Intelligent IoT and Automotive Business Line of ARM Technology, Cao Lihong, Senior Director of Technology and Market Development of ASE Technology, Sheng Fangwei, Senior Technical Expert of RISC-V CPU of DAMO Academy, Shan Gang, Vice President of Marketing of Data Center Product Department of Montage Technology Co., Ltd., Li Liji, Global Vice President of EDA and General Manager of Asia Pacific Technology of Siemens, Lan Bijian, CEO of Suzhou Fuhu Electronic Technology Co., Ltd., He Qing, CEO of Hangzhou Xingxin Technology Co., Ltd., and Li Lei, researcher of Nanjing Institute of Intelligent Technology, Zhongke Science and Technology, delivered wonderful reports, focusing on high-performance computing solutions, the combination of AI and EDA, the application of AI in analog chip design, and large model auxiliary chips.
Four thematic forums, all the cutting-edge trends are known
On September 27, the AI Large Model Empowerment Chip Design Forum, RISC-V Ecological Forum, Communication Chip and RF Technology Forum, IC Design and Strong Core IC Roadshow were held at the same time. Representatives from more than 40 companies, including chip design, packaging and testing, universities and institutes, and academic institutions, shared cutting-edge technology trends and industry insights. In the strong core IC roadshow, 14 outstanding companies introduced their latest products and technological innovations.
"2024 Strong Core China-Innovative IC Selection"
At the welcome dinner on September 25, the award ceremony of "Strong Core China-Innovative IC Evaluation and Release" organized by the China Integrated Circuit Design Innovation Alliance was grandly held.
Ren Qiwei, vice chairman of China Integrated Circuit Design Innovation Alliance, Liu Weiping, executive director of China Integrated Circuit Design Innovation Alliance, Shi Longxing, chief professor of Southeast University and leader of the expert group of China Integrated Circuit Design Innovation Alliance, Cheng Jinge, Secretary-General of China Integrated Circuit Design Innovation Alliance, Ye Tianchun, Secretary-General of China Integrated Circuit Innovation Alliance, Du Xiaoli, Executive Vice Chairman of China Integrated Circuit Design Innovation Alliance, Wei Shaojun, chairman of the China Integrated Circuit Design Innovation Alliance, presented awards to the winning enterprises and took a group photo.
The selection has been actively participated by nearly 200 enterprises, and has been screened by the editorial board of China Integrated Circuit magazine and 7 experts of the alliance expert group, and finally selected the Outstanding Product Award, Excellent Product Award, Innovative Application Award and Cutting-edge Product Award, a total of 36 award-winning companies and their representative products. They are:
Product Excellence Award
UNISOC (Shanghai) Technology Co., Ltd
Haiguang Information Technology Co., Ltd
Montage Technology Co., Ltd
Beijing Xinchi Semiconductor Technology Co., Ltd
Guangdong Yuefang Technology Co., Ltd
Outstanding Product Award
Pingtou (Shanghai) Semiconductor Technology Co., Ltd
ARM Technology (China) Co., Ltd
Beijing CEC Huada Electronic Design Co., Ltd
Shenzhen Goodix Technology Co., Ltd
Guangzhou Ankai Microelectronics Co., Ltd
Torch Core Technology Co., Ltd
Shanghai Anlu Information Technology Co., Ltd
Zhuhai Yiwei Semiconductor Co., Ltd
Hexin Xingtong Technology (Beijing) Co., Ltd
Zhuhai Core Power Technology Co., Ltd
Innovative Application Award
Shenzhen Longsys Electronics Co., Ltd
GigaDevice Technology Group Co., Ltd
Shanghai Belling Co., Ltd
Beijing Zhixin Microelectronics Technology Co., Ltd
Black Sesame Intelligent Technology Co., Ltd
Guangdong StarFive Technology Co., Ltd
Ascend Microelectronics (Suzhou) Co., Ltd
Suzhou NOVOSENSE Microelectronics Co., Ltd
Chengdu Watertek Information Technology Co., Ltd
Hangzhou Jinghua Microelectronics Co., Ltd
Cutting-edge product award
Geke Micro Co., Ltd
Hunan Guoke Microelectronics Co., Ltd
Vimicro Technology Co., Ltd
CLP Shentai Information Technology Co., Ltd
Zhuhai Allwinner Technology Co., Ltd
Qingdao Xinxin Microelectronics Technology Co., Ltd
Shanghai Hejian Industrial Software Group Co., Ltd
Hefei Kuxin Microelectronics Co., Ltd
Aixin Yuanzhi Semiconductor Co., Ltd
Maxic Technology (Beijing) Co., Ltd
Shiqing Intelligent Technology (Shanghai) Co., Ltd
"2024 Strong Core China-Innovative IC" aims to select a number of strong core products with leading technology, strong competitiveness and reliable quality for key areas such as AI computing power, storage, microprocessors/controllers, FPGAs, RF communications, power management, power and drives. Recommend domestic high-quality chips for system enterprises and user units, and promote domestic IC applications.
IC Show
The offline exhibition IC Show at the venue organized more than 100 domestic chip companies, innovative Chinese chips, automotive electronics and more than 1,500 domestic electronic product suppliers to gather together to create scientific and technological innovation and design inspiration, and build an exchange and cooperation platform from chip-system integration to machine application.