On the morning of January 20, the construction of Sihe Microelectronics Clean Plant officially started. The Sihe Microelectronics Project is invested and constructed by Shenzhen Zhongke Sihe Technology Co., Ltd., and is also an enterprise invested and invested by Xiamen Semiconductor Investment Group Co., Ltd. The project is located in the No. 2 and No. 4 pilot plants of Haicang Semiconductor Industry Base, with an area of about 25,000 square meters, a total investment of 550 million yuan, and a post-production output value of 8 to 1 billion yuan, and is scheduled to be put into operation in the second quarter of this year.
Based on the transformation of major scientific and technological achievements of national science and technology and the scientific research strength of Zhongke Sihe itself, in recent years, Zhongke Sihe has continued to devote itself to building a Panel-level (board-level) high-density integrated circuit packaging process manufacturing platform, and based on this platform to carry out research and development work in the fields of advanced packaging technology, integrated circuit power chips and polymer material applications, etc., and has achieved fruitful results, meeting the needs of customers in various fields such as consumer electronics, industrial control, automotive electronics, communications/servers, medical and so on. Effectively cracked the "card neck" problem in a series of packaging fields.
Relying on the technical accumulation and leading advantages of the Zhongke Sihe team in the Panel level (board level) high-density integrated circuit Fan out (fan-out) packaging process, MOSFET devices, GaN devices, IPM modules, DC-DC, LDO, PMIC and other power management chips, RF Switching and other RF devices, the project will build a world-class discrete device that meets the national integrated circuit industry development plan and the Outline of the Xiamen Integrated Circuit Industry Development Plan/ Module Panel-level Fanout packaging leading enterprise.
