In the context of today's highly information-based society, accurate data analysis and in-depth industry research have become an indispensable compass for corporate strategic planning, market expansion and investment decision-making. After long-term market research and data analysis, the research team of Zhiyan Consulting has launched the "2024-2030 Market Development Prospect and Investment Risk Assessment Report of China's Integrated Circuit Packaging and Testing Industry", in order to provide a high-quality and professional industry analysis for the industry.
Based on the Zhiyan team's deep understanding and accurate grasp of the integrated circuit packaging and testing industry, this research report provides a comprehensive and systematic analysis of the past, present and future of the industry by collecting industry data from around the world and using advanced data analysis models. The operation rules of each market segment were deeply excavated, and the key indicators such as market capacity, growth rate, competition pattern and profit model were analyzed and interpreted in detail quantitatively and qualitatively.
The content of the report not only covers the analysis of macroeconomic trends and the in-depth interpretation of industrial policies, but also includes the detailed portrayal of buyer behavior and the trend prediction of technological innovation. We use a combination of quantitative analysis and qualitative interviews to capture subtle changes in market dynamics while ensuring data accuracy.
In addition, we also pay special attention to the leading companies in the industry around the world, and provide valuable industry insights and business enlightenment for industry readers by comparing and analyzing their business strategies, market layouts and innovation capabilities.
As a well-known research institution in the industry, the research team of Zhiyan is well aware of the importance of high-quality research reports for corporate decision-making. Therefore, in the process of compiling this report, we have always adhered to a scientific and rigorous research attitude, and strive to provide readers with a truly valuable industry guide through detailed data, in-depth analysis and judgmental opinions.
Integrated circuit packaging and testing is the post-process of integrated circuit manufacturing, which refers to the process of processing the tested wafer into an independent integrated circuit according to the product model and functional requirements, which is a key process to improve the stability and manufacturing level of integrated circuits, and is mainly divided into two links: packaging and testing.
After decades of development and evolution, integrated circuit packaging technology can be summarized into five stages, from wired to wireless connection, from chip-scale packaging to wafer-level packaging, from two-dimensional packaging to three-dimensional packaging. The first stage: before the 70s of the 20th century, the packaging form was in-line packaging, and the representative technology was double in-line packaging (DIP); The second stage: it appeared after the 80s of the 20th century, mainly based on the derivation of surface mount technology and needle grid array packaging; The third stage: after entering the 90s of the 20th century, ball grid array packaging (BGA), chip scale packaging (CSP), flip package (FC), etc. began to appear; The fourth stage: Since the end of the 20th century, packaging technology has developed from two-dimensional packaging to three-dimensional packaging, and system-in-package (SiP), bumping, multi-chipset packaging (MCM) and other technologies have emerged. The fifth stage: In the first decade of the 21st century, through-silicon vias (TSV), fan-out integrated circuit packaging (Fan-Out), three-dimensional packaging (3D) and so on began to appear.
Compared with the integrated circuit design and integrated circuit manufacturing industry, the integrated circuit packaging and testing industry is a labor-intensive industry, although the technical content is low, but it is an important link for the mainland to enter the integrated circuit industry at the earliest. With the development of technology, the correlation and synergy between all aspects of the integrated circuit industry are becoming more and more demanding, so even the integrated circuit packaging and testing industry with low technical content is particularly important in the development process of the entire integrated circuit industry. At present, the mainland integrated circuit packaging and testing industry has developed stably and has certain advantages in terms of labor, and the technology of domestic leading integrated circuit packaging and testing enterprises has been developing continuously and the gap with the international has become smaller and smaller, and the industry scale is also showing a steady growth trend. According to the data, the revenue scale of the integrated circuit packaging and testing industry in mainland China in 2023 will be 293.22 billion yuan.
The upstream manufacturers of integrated circuit packaging and testing include wafer manufacturers and packaging material manufacturers, and the downstream application market can be divided into traditional application markets and emerging application markets. The operation mode of the integrated circuit packaging and testing industry is that the integrated circuit design company designs the integrated circuit layout according to the market demand, because the integrated circuit design company itself does not have a chip manufacturing plant and a packaging and testing factory, the integrated circuit design company completes the chip design, and hands it over to the wafer foundry to manufacture the wafer, and the wafer is delivered to the packaging and testing company after the completion of the wafer, and the chip packaging and testing company carries out the chip packaging and testing by the packaging and testing company, and then the integrated circuit design company sells the integrated circuit products to the manufacturer of electronic products. Finally, it is sold to the downstream end market by the manufacturer of the complete electronic machine.
The mainland integrated circuit packaging and testing enterprises are mainly foreign-invested enterprises and private enterprises, of which foreign capital occupies a dominant position, accounting for more than 60% of the domestic packaging and testing industry. There is an obvious gap between private enterprises and foreign-funded enterprises in terms of capital scale, investment capacity, and technical level, but in recent years, the technological gap has been narrowing rapidly. Due to the limitations of capital and technology and other factors, most of the packaging forms of domestic private enterprises still stay in the low-end fields such as DIP, TO, QFP, etc., but a number of packaging enterprises represented by Changdian Technology and Huatian Technology have been supported by the capital market in recent years, and have made a lot of investment in technology research and development and advanced equipment. Remarkable results have been achieved in the development and application of advanced packaging forms such as MCM, and the gap with the international advanced technology level is rapidly narrowing, but due to the limited investment capacity, there is still a large gap between the packaging scale and foreign-funded enterprises.
We firmly believe that the "2024-2030 China Integrated Circuit Packaging and Testing Industry Market Development Prospect and Investment Risk Assessment Report" will become an important tool for you to gain insight into market dynamics and grasp industry trends. Whether you are a corporate decision-maker, market analyst or relevant authorities, this report will provide you with valuable information support and decision-making basis to help you move forward in a complex and volatile market environment.
Data Description:
1: The core data of this report has been updated to December 2023 (the relevant financial indicators of non-listed companies in the report are affected by corporate credit approval, and there may be a certain lag), and the forecast period of the report is 2024-2030.
2: In addition to the first-hand research information and data, authoritative data sources such as the National Bureau of Statistics, China Customs, industry associations, and public reports of listed companies (prospectuses, transfer prospectuses, annual reports, inquiry reports, etc.) also constitute the data sources of this report. The first-hand data comes from the first-hand information data obtained by the research team from interviews with key enterprises in the industry, and the main interview subjects include corporate executives, industry experts, technical leaders, downstream customers, distributors, agents, distributors and upstream raw material suppliers. Secondary sources mainly include relevant industry news, company annual reports, non-profit organizations, industry associations, government agencies and third-party databases from around the world.
3: The core data of the report is based on the strict data collection, screening, processing, analysis system and independent calculation model of the Zhiyan team to ensure the accuracy and reliability of statistical data.
4: The data used in this report are all from compliance channels, and the analysis logic is based on the professional understanding of the Zhiyan team, which clearly and accurately reflects the research views of analysts.
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