According to CASA data, SiC substrate and epitaxy are expected to decline at an annual rate of 8% as industrial technology gradually matures (yield improvement) and capacity expansion (supply improvement).
SiC substrate and epitaxial wafer price
SiC substrate price development trend (RMB/cm²)
The price of 6-inch conductive silicon carbide village bottom decreases year by year with the increase of yield, and the prices in 2022-25 are 6600/6300/6000/5500 yuan/piece, respectively.
In 2022, the price of 6-inch semi-insulated silicon carbide substrate will be about 7,000 yuan / piece, and it is expected to be reduced to 6,000 yuan / piece in 2025.
SiC substrates, devices, and epitaxial wafer market size forecasts
The main reasons for the low domestic production rate of SiC epitaxial wafers:
- There is a shortage of imported epitaxial furnaces
- Domestic epitaxial furnace to be verified
- The mass production quality of epitaxial wafers is unstable (consistency in concentration and thickness), and it is difficult to mass produce
Price development trend of silicon carbide epitaxial wafer (RMB/cm^2)
Current status of SiC substrate share at home and abroad
SiC equipment and manufacturing status
SiC long crystal: The difficulty of the process lies in temperature control, and the thermal field materials still rely on imports
SiC long crystal: The difficulty of the process lies in temperature control, and the thermal field materials still rely on imports
SiC epitaxial furnace: CVD has moderate cost &good quality &fast growth rate, which is the mainstream epitaxial technology
SiC epitaxial furnace: CVD has moderate cost &good quality &fast growth rate, which is the mainstream epitaxial technology
SiC dicing: SiC wafers have high hardness, brittleness and low toughness, and traditional wafer mechanical cutting is easy to cause more defects. Basically, laser cutting is used
SiC slicing: In the future, diamond wire cutting and laser cutting will replace mortar wire as the mainstream technology
In the future, diamond wire cutting and laser cutting will replace mortar wire as mainstream technology
Other SiC devices
Other SiC equipment also includes grinding, polishing, modification, slicing, oxidative annealing, thinning and many other equipment, which are not listed here.