The news said that Samsung is testing a "combination coil antenna" for its mobile phones, taking into account heat dissipation and signal

IT House News on October 9, Samsung adopted a larger heat dissipation solution on this year's Galaxy S23 series, and according to the news of the X platform whistleblower RGcloudS, Samsung is testing a technology called "combined coil antenna", which is said to be able to integrate antenna, wireless charging, NFC and other technologies in the heat sink that wraps the fuselage, thereby improving the signal strength of the mobile phone while ensuring a large area of heat dissipation.

▲ Image source RGcloudS posted on the X platform

▲ RGcloudS uses Huawei Mate 40 to produce a demonstration of heat dissipation technology

RGcloudS said that the heat sink used in the current mobile phone will affect the signal of the mobile phone, so the current mobile phone back plate heat sink coverage is not more than 90%.

The combined heat dissipation copper sheet developed by Samsung will be built using a flexible printed circuit board (FPCB), support integrated wireless charging and NFC, and also support UWB chip, Bluetooth and other functions, which can take into account heat dissipation while ensuring signal strength.

However, IT House found that RGcloudS also claimed that mobile phones using this scheme cannot use fast wireless charging of more than 80W, and the temperature generated by wireless charging is 50% higher than that of wired charging, and at this temperature, the problem of wireless charging of mobile phones is easy to reduce the life of communication chips such as NFC integrated in the heat dissipation copper sheet.