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At the MWC 2024 conference, Honor CEO Zhao Ming revealed in a media interview two important products to be released: a disruptive AIPC and an ultra-thin flagship fold

author:PConline太平洋科技

At the MWC 2024 conference, Honor CEO Zhao Ming revealed in a media interview two important products to be released: a disruptive AI PC and an ultra-thin and light flagship folding phone, the Magic V3. According to the grapevine, these two new products should be released in July, and there will be a series of new products such as Honor tablets. #荣耀赵明称将发布一款颠覆性AI PC#

Zhao Ming pointed out that the Honor AI PC will use device-side AI technology, which is an innovative application in the PC field. The application of device-side AI technology means that users can experience intelligent and efficient operation even when offline, which will be a big selling point of Honor AI PCs. Zhao Ming also revealed in the interview that Honor's new AI PC is a very subversive product in terms of design ideas, aesthetics, and functionality, which is worth looking forward to!

According to the blogger's revelations, Honor's upcoming ultra-thin notebook has set a record for single product patents in the AI PC industry, with more than 30 exclusive new patents. If true, this news will add a touch to Honor's technological innovation. Another blogger even more intriguing revealed that he claimed to have picked up a file bag that may contain the Honor MagicBook X Pro, which looks very thin and light.

At the MWC 2024 conference, Honor CEO Zhao Ming revealed in a media interview two important products to be released: a disruptive AIPC and an ultra-thin flagship fold
At the MWC 2024 conference, Honor CEO Zhao Ming revealed in a media interview two important products to be released: a disruptive AIPC and an ultra-thin flagship fold
At the MWC 2024 conference, Honor CEO Zhao Ming revealed in a media interview two important products to be released: a disruptive AIPC and an ultra-thin flagship fold
At the MWC 2024 conference, Honor CEO Zhao Ming revealed in a media interview two important products to be released: a disruptive AIPC and an ultra-thin flagship fold

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